Recommendations For Applying UHMW Tapes

Proper surface preparation is the most critical element in the laminating operation. Products supplied with pressure sensitive tapes are subject to breakdown when in contact with contaminated surfaces.

A conscious effort on the part of the installer is required. The substrate should be as smooth and clean as possible. To prepare the substrate for bonding, wipe with a clean cloth. If oil or heavy contamination is present, you may need to use a totally evaporating solvent such as lacquer thinner or MEK. If only light soil and surface dust is present, an isopropyl wipe should be sufficient. Turn the cloth frequently to avoid decontaminating the surface.

When clean and dry apply the pressure sensitive system. Be careful when pulling off the release liner, refraining from contact with the adhesive as this could potentially reduce bond strength. It is recommended that when applying long lengths, only remove 24" to 36" of liner at a time to make it easier to control. Once the product has been installed, a "J" roller or hand roller should be used to assure proper pressure and secure the bond. It is recommended that the temperature be above 50 degrees Fahrenheit when applying pressure sensitive tapes.